PCB & Custom Water Block Design Ree Cooll

**Project:** High-Power LED UV Module Engineering & Custom Waterblock Replication
**Date:** September 20, 2026
**Methodology:** Reverse Engineering / Exact Replication & Optimization 

### 1. Project Overview

The objective of this project is to reverse-engineer and accurately replicate a liquid-cooled, high-power LED illumination system. The project requires designing a **Printed Circuit Board (PCB)** featuring smart relay-based switching logic and a **3D mechanical model of a water cooling block (Waterblock)** that matches the current system's geometry, ensuring a perfect thermal fit. 

### 2. Technical Specifications of Components to Replicate

### A. Water Cooling Block (Mechanical Structure)

* **Outer Length:** 50 mm
* **Outer Width:** 30 mm
* **Block Thickness/Height:** 20 mm
* **Hydraulic Connections:** 2 top compression fittings (approx. exposed height: 30 mm).
* **Mounting Points:** 4 perimeter threaded holes for fastening, with a 35.5 mm spacing between centers on the top notch.

### B. LED Module & PCB Critical Areas

* **Total Internal Enclosure Housing:** 44 mm - 45 mm length x 25 mm width.
* **Main LED Matrix (Maximum Heat Dissipation Area):** 22 mm length x 12 mm width. *The waterblock base must sit directly flat on top of this specific area.*
* **Driver / Secondary Circuit Zone:** 7 mm to 10 mm length x 12 mm to 25 mm width, located adjacent to the LED emitter matrix.

### 3. Electronic Circuit Logic & Drivers (PCB Engineering)

The routed PCB must interface with two independent constant-current LED drivers through a **Relay** and a **Filter** stage. The switching sequence must operate under the following logic: 

### Input Driver Specifications:

1. **Low-Power Driver (Small):** Model HG-RZ12W300-NF | Load: 8-12W | Output: DC 24-42V @ 300mA ±5%
2. **High-Power Driver (Large):** Model HG-RZ36W900-NF | Load: 24-36W | Output: DC 24-42V @ 900mA ±5% | PF > 0.9 | Flicker-Free

### Required Operating Modes:

* **Mode 1 (Low Power):** When the relay triggers the **Small Driver (300mA)** line, the filtered current must power **ONLY the Small LED**. The Large LED matrix must remain completely off.
* **Mode 2 (High Power):** When the relay switches to the **Large Driver (900mA)** line, the filtered current must power **BOTH the Large LED and the Small LED simultaneously**, safely distributing the total 900mA output across the circuit.

### 4. Scope of Work & Expected Deliverables

### Electronics Phase (Electronic Engineer):

1. Design the schematic diagram supporting the relay switching, noise filtering, and LED matrix protection.
2. Optimize the PCB layout and trace widths to handle continuous currents up to 900mA.
3. **Deliverables:** PCB project source files, manufacturing-ready **Gerber files (including Drill files)**, Bill of Materials (**BOM**) with commercial component sourcing codes, and a fully populated **3D STEP model** of the final board (critical for mechanical clearance checks).

### Mechanical Phase (3D / Industrial Designer):

1. Accurately model the 50x30x20mm waterblock based on provided photos and the PCB STEP model delivered by the electronic engineer.
2. Design internal cooling liquid channels/microchannels directly over the LED matrix contact area (22x12mm) to maximize heat transfer.
3. Incorporate appropriate sealing gaskets/O-rings to guarantee absolute water tightness and protect the electronics from leaks.
4. **Deliverables:** Final **STEP/IGES** files for CNC machining and detailed 2D technical drawings (PDF/DXF) featuring dimensions and manufacturing tolerances.