Industrial 6-Layer PCB Development
Budget / SalaryA$250–750
TypeFreelance project
LocationRemote
Posted3 hours ago
I have an industrial-grade product in the works and need an expert set of eyes—and hands—on the hardware. The schematic is drafted but still open for improvement, so the first task is a thorough review that catches any power-integrity pitfalls or signal-integrity traps before we lock it down.
Once the schematic is solid, I need a complete multilayer layout (six layers or more). The board must reliably handle:
• Signal processing paths that demand controlled impedance
• A wireless communication module
• On-board video recording circuitry
• A high-speed MCU running at roughly 500 MHz
Please route with EMI-aware practices, keep differential pairs tight, and balance power planes for clean return paths. I’ll also rely on you to choose an appropriate stack-up, define design rules, and generate manufacturing outputs—Gerbers, drill files, pick-and-place, and a clean BOM—ready for my assembler.
Deliverables will be considered complete when the design passes DRC/ERC, meets your own simulation checks, and is reproducible by any mainstream PCB house without further tweaks.
If you typically work in Altium, KiCad, or a comparable professional toolset, that’s perfect—just share native files alongside the production package so I can maintain the design long-term. Looking forward to collaborating and getting this board into fabrication.
This is a design for manufacture (mandatory) project:
- Define and agree the HDI stack up (layer count, micro via structure, material, impedance) before layout
- Proper BGA fanout (via in pad micro vias) - no attempt to squeeze traces between balls
- Design strictly to the chosen fabricators stated capability - deliver a DFM check/fabricator confirmation of manufacturability before release.
To qualify for this project you must be able to show prior work with multilayer PCB development:
1. Show 2–3 boards where you laid out a fine-pitch (≤ 0.5 mm) BGA — state the pitch, ball count, layer count, and via strategy for each.
2. Have you designed HDI boards with microvias / via-in-pad? Show examples.
Once the schematic is solid, I need a complete multilayer layout (six layers or more). The board must reliably handle:
• Signal processing paths that demand controlled impedance
• A wireless communication module
• On-board video recording circuitry
• A high-speed MCU running at roughly 500 MHz
Please route with EMI-aware practices, keep differential pairs tight, and balance power planes for clean return paths. I’ll also rely on you to choose an appropriate stack-up, define design rules, and generate manufacturing outputs—Gerbers, drill files, pick-and-place, and a clean BOM—ready for my assembler.
Deliverables will be considered complete when the design passes DRC/ERC, meets your own simulation checks, and is reproducible by any mainstream PCB house without further tweaks.
If you typically work in Altium, KiCad, or a comparable professional toolset, that’s perfect—just share native files alongside the production package so I can maintain the design long-term. Looking forward to collaborating and getting this board into fabrication.
This is a design for manufacture (mandatory) project:
- Define and agree the HDI stack up (layer count, micro via structure, material, impedance) before layout
- Proper BGA fanout (via in pad micro vias) - no attempt to squeeze traces between balls
- Design strictly to the chosen fabricators stated capability - deliver a DFM check/fabricator confirmation of manufacturability before release.
To qualify for this project you must be able to show prior work with multilayer PCB development:
1. Show 2–3 boards where you laid out a fine-pitch (≤ 0.5 mm) BGA — state the pitch, ball count, layer count, and via strategy for each.
2. Have you designed HDI boards with microvias / via-in-pad? Show examples.
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