3D-Printable Device Case Design
Budget / Salary€30–250
TypeFreelance project
LocationRemote
Posted1 hour ago
I’m looking for a skilled CAD modeller to create a custom case for one of my devices that I’ll be printing myself on an FDM machine in PLA. Port accessibility is the single most important requirement, so every button, speaker grill, charging socket and sensor area must remain fully exposed and usable once the case is fitted.
Here’s what I need from you:
• A clean, watertight 3D model supplied as STL (ready to slice) plus the editable source file in your preferred package (Fusion 360, SolidWorks, or similar).
• Precise wall-thicknesses and tolerances that suit standard PLA prints—think 0.2 mm layer height, 0.4 mm nozzle.
• Rounded edges and internal fillets that minimise print stress, with no unsupported overhangs beyond what PLA can handle without excessive support.
• A brief note inside the file or as a text document outlining any special print settings you recommend.
If you use parametric dimensions, I’ll be able to tweak the fit later, so that would be a bonus. As soon as we start I’ll send accurate measurements and reference photos so you can model to spec. Let me know your typical turnaround time and which CAD tool you prefer, and we can get this started right away. I’m looking for a CAD / 3D product designer to develop a compact SkyOrb enclosure for FDM 3D printing.
Main enclosure dimensions:
Width: 50 mm
Depth: 58 mm
Height: 68 mm
Wall thickness: 1.6–1.8 mm
Completely flat bottom
Removable bottom cover
Preferably printable without supports, or with minimal supports
Internal components:
GC9A01 1.28" round TFT display:
PCB size: 38 × 45 mm
Visible round display diameter: 35.7 mm
Module thickness: 4.5 mm
Mounting-hole center distance: 19.5 mm
Mounting-hole diameter: 2 mm
Pin/header connector points downward
Pin/header height: 10 mm
ESP32 board:
PCB size: 51.6 × 28.6 mm
Overall thickness including pins: 13 mm
Mounting-hole pitch: 47 × 23 mm
The board must be mounted horizontally inside the base
Long axis runs front-to-back
Header pins point upward
USB-C must face directly toward the rear and align with an opening in the rear wall
Additional components:
Buzzer: approximately Ø12 × 8.5 mm
ATGM336H GPS module with external antenna; exact dimensions will be provided later
Display, GPS, buzzer and wiring should be located mainly inside the upper/head section
A clear internal cable path from the head to the ESP32 is required
Enclosure design:
Smooth, organic, monolithic product shape
Upper section should resemble a rounded cylindrical / horn-like form
Approximate external front diameter: 44–46 mm
Display/front face tilted approximately 18–20° from vertical
Rear of the head must be strongly rounded
The head must blend smoothly and completely into the base
No thin neck, separate stand, visible step or sharp transition between head and base
Bottom must remain completely flat
No ventilation holes
No touch sensor openings
Rear should have only a clean USB-C opening
Front should include a flat area for a metal SkyOrb logo up to 20 mm wide
Required deliverables:
Editable CAD source and/or STEP file
Print-ready STL files
Separate shell, bottom cover and bezel/retainer if required
Watertight geometry
Proper FDM manufacturing clearances, typically around 0.3–0.5 mm
Most important workflow requirement:
Before designing the internal mounts or producing the final STL, I need to approve the exterior CAD shape first. Please provide Front, Side, Top and Isometric CAD renders of the enclosure. Only after the exterior shape is approved should the internal structure and final print-ready files be completed.
Here’s what I need from you:
• A clean, watertight 3D model supplied as STL (ready to slice) plus the editable source file in your preferred package (Fusion 360, SolidWorks, or similar).
• Precise wall-thicknesses and tolerances that suit standard PLA prints—think 0.2 mm layer height, 0.4 mm nozzle.
• Rounded edges and internal fillets that minimise print stress, with no unsupported overhangs beyond what PLA can handle without excessive support.
• A brief note inside the file or as a text document outlining any special print settings you recommend.
If you use parametric dimensions, I’ll be able to tweak the fit later, so that would be a bonus. As soon as we start I’ll send accurate measurements and reference photos so you can model to spec. Let me know your typical turnaround time and which CAD tool you prefer, and we can get this started right away. I’m looking for a CAD / 3D product designer to develop a compact SkyOrb enclosure for FDM 3D printing.
Main enclosure dimensions:
Width: 50 mm
Depth: 58 mm
Height: 68 mm
Wall thickness: 1.6–1.8 mm
Completely flat bottom
Removable bottom cover
Preferably printable without supports, or with minimal supports
Internal components:
GC9A01 1.28" round TFT display:
PCB size: 38 × 45 mm
Visible round display diameter: 35.7 mm
Module thickness: 4.5 mm
Mounting-hole center distance: 19.5 mm
Mounting-hole diameter: 2 mm
Pin/header connector points downward
Pin/header height: 10 mm
ESP32 board:
PCB size: 51.6 × 28.6 mm
Overall thickness including pins: 13 mm
Mounting-hole pitch: 47 × 23 mm
The board must be mounted horizontally inside the base
Long axis runs front-to-back
Header pins point upward
USB-C must face directly toward the rear and align with an opening in the rear wall
Additional components:
Buzzer: approximately Ø12 × 8.5 mm
ATGM336H GPS module with external antenna; exact dimensions will be provided later
Display, GPS, buzzer and wiring should be located mainly inside the upper/head section
A clear internal cable path from the head to the ESP32 is required
Enclosure design:
Smooth, organic, monolithic product shape
Upper section should resemble a rounded cylindrical / horn-like form
Approximate external front diameter: 44–46 mm
Display/front face tilted approximately 18–20° from vertical
Rear of the head must be strongly rounded
The head must blend smoothly and completely into the base
No thin neck, separate stand, visible step or sharp transition between head and base
Bottom must remain completely flat
No ventilation holes
No touch sensor openings
Rear should have only a clean USB-C opening
Front should include a flat area for a metal SkyOrb logo up to 20 mm wide
Required deliverables:
Editable CAD source and/or STEP file
Print-ready STL files
Separate shell, bottom cover and bezel/retainer if required
Watertight geometry
Proper FDM manufacturing clearances, typically around 0.3–0.5 mm
Most important workflow requirement:
Before designing the internal mounts or producing the final STL, I need to approve the exterior CAD shape first. Please provide Front, Side, Top and Isometric CAD renders of the enclosure. Only after the exterior shape is approved should the internal structure and final print-ready files be completed.
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